Electronics and connectivity

In-depth testing, revealing invisible weaknesses

Boards, sensors and electronic modules are subject to severe thermal and mechanical stress. Our loudspeakers detect invisible faults and guarantee the performance of connected systems over time.

Forme décorative

Tested equipment

  • Smartphones
  • Laptop computers
  • Ticket dispensers
  • Printed circuit boards
  • On-board electronics
  • Thermostats
  • Presence sensors
  • Safety systems
  • Audio equipment

Standards

  • IEC 60068
  • JESD22
  • NF EN 13383
  • NF EN 1367-1
  • JJF 1101
  • MIL STD 883
  • ISO 9227
  • NF EN 12371
  • IEC 60068-2-78
  • NF EN 14024
  • IEC 60068-2-38
  • NF EN 12 206
  • CEKAL EN 1279-2

Types of tests

  • Temperature
  • Humidity
  • Burn-in
  • Troubleshooting
  • Thermal shock
  • Freeze-thaw

Speaker models

  • Laboratory test chamber (LABCAL)
  • Vibration chamber (VIBCAL)
  • Bi-climatic chamber
  • Thermal shock enclosure (SCAL)
  • Environmental test chamber (EXCAL)
  • Large-volume room (WINCAL, type G)
  • Air jet (GT-FC)
  • Burn-in chamber